NSN 5962-01-309-8030, 5962013098030 Microcircuit Memory Parts Sourcing
If you have been looking for Atmel Corporation parts listed alongside the NSN 5962013098030, ASAP Distribution has you covered with our unmatched inventory of items Microcircuit Memory. With over 2 billion parts readily available for purchase on our website, customers can get competitive pricing offers and rapid lead-times on top NSN part numbers such as AT28HC256LE-12LM-883, AT28HC256 12LM 883. Explore our NSN parts catalog at your leisure, or you may take advantage of our provided search engine to find specific parts in a matter of moments. If you are interested in this particular component or others listed across our website, you may begin the procurement process at any time through the submission of an Instant RFQ form. Using the information that you submit to us, our team of industry experts will quickly craft you a quote that accommodates your individual needs and requirements for NSN 5962013098030.
Alternative NSN: 5962-01-309-8030 | Item Name : Microcircuit Memory | FSG : 59 Electrical and Electronic Equipment Components | Federal Supply Class (FSC) : 5962 Microcircuits Electronic | NIIN: 013098030 | NCB Code: USA (01) |
Part Number's List for NSN 5962-01-309-8030, 5962013098030
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
AT28HC256LE-12LM-883 | Atmel Corporation | microcircuit memory | Avl | RFQ |
AT28HC256 12LM 883 | Atmel Corporation | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013098030
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.560 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.120 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.458 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.088 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS AND METAL |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 25 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM POWER SOURCE AND 6.2 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
CBBL | FEATURES PROVIDED | BIDIRECTIONAL AND BURN IN AND ERASABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
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