NSN 5962-01-299-6398, 5962012996398 Microcircuit Memory Parts Sourcing
If you have been looking for Advanced Micro Devices Inc, Atmel Corporation, Raytheon Company, Seeq Technology Inc parts listed alongside the NSN 5962012996398, ASAP Distribution has you covered with our unmatched inventory of items Microcircuit Memory. With over 2 billion parts readily available for purchase on our website, customers can get competitive pricing offers and rapid lead-times on top NSN part numbers such as AM2817A-25 BUC, AT28C17 25LM 883, G278424-852, LM2817A-250 B. Explore our NSN parts catalog at your leisure, or you may take advantage of our provided search engine to find specific parts in a matter of moments. If you are interested in this particular component or others listed across our website, you may begin the procurement process at any time through the submission of an Instant RFQ form. Using the information that you submit to us, our team of industry experts will quickly craft you a quote that accommodates your individual needs and requirements for NSN 5962012996398.
| Alternative NSN: 5962-01-299-6398 | Item Name : Microcircuit Memory | FSG : 59 Electrical and Electronic Equipment Components | Federal Supply Class (FSC) : 5962 Microcircuits Electronic | NIIN: 012996398 | NCB Code: USA (01) |
Part Number's List for NSN 5962-01-299-6398, 5962012996398
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| AM2817A-25 BUC | Advanced Micro Devices Inc | microcircuit memory | Avl | RFQ |
| AT28C17 25LM 883 | Atmel Corporation | microcircuit memory | Avl | RFQ |
| G278424-852 | Raytheon Company | microcircuit memory | Avl | RFQ |
| LM2817A-250 B | Seeq Technology Inc | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962012996398
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 788.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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